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PERFORMACE ADVANTAGES

Protects Devices from Damage
Imrpoves Process Consistency
Boosts automation productivity
Lightweight & sustainable options
Reduces cost of operations

WAFFLE TRAYS (WAFFLE PACKS)

Waffle trays are designed for handling bare dies and small semiconductor components, offering precise placement and protection.

Key Features

  • Grid-based pocket structure for individual die placement
  • Designed to maintain orientation and prevent movement
  • Includes tray, lid, and locking mechanism system
  • Compatible with automated pick-and-place systems

Material Options (Industry Standard)

Choose the right grade for your process

Preferred for ESD

Carbon-loaded ABS / HIPS

Conductive ESD-safe material. Ideal for protecting sensitive dies from electrostatic discharge.

Conductive ESD-safe

Polycarbonate (PC)

High strength and dimensional stability. Suitable for environments requiring structural precision.

Up to ~120°C

High-performance plastics (PSU, MPPO)

For advanced use — suitable for bake processes at 125–150°C+.

125–150°C+ bake

👉 Conductive materials are preferred for semiconductor safety.

Thermal Performance

Heat resistance by material type

Standard ABS

~60–125°C

Not suitable above this range — may warp at higher temperatures.

May warp — not for baking

Polycarbonate (PC)

~120°C

Suitable for moderate-temperature environments and precision applications.

Moderate heat resistance

High-temp (PSU / MPPO)

125–150°C+

Suitable for bake processes — highest thermal grade available.

Bake process ready

ESD Properties

Electrostatic discharge protection

Prevent ESD damage
Conductive / dissipative materials prevent electrostatic damage to dies.
—
Static discharge protection
Protects sensitive dies from static discharge failures during handling.

Why ESD matters for bare dies

Bare dies are significantly more vulnerable to static than packaged ICs. Conductive and dissipative waffle tray materials eliminate the risk of electrostatic damage at every stage — from storage to pick-and-place assembly.

Performance Advantages

Why these trays perform better

Die Collision Prevention

Prevents die collision and movement during transport

Pinpoint Positioning

Maintains precise positioning for automation

Cleanroom Compatible

Supports cleanroom and high-precision environments

APPLICATIONS

BARE DIE HANDLING

Microelectronics

R&D

Sample Storage

Compatible IC Packages

Applications

BGA

QFN

QFP

SOP

LGA

DIP

BGA, QFN, QFP, SOP, LGA, DIP and similar IC packages

Ready to simplify your supply?

Reliable trays. Smarter processes. Better performance.

Contact Us