PERFORMACE ADVANTAGES
Protects Devices from Damage
Imrpoves Process Consistency
Boosts automation productivity
Lightweight & sustainable options
Reduces cost of operations
JEDEC IC MATRIX TRAYS
Designed for automated handling, testing, burn-in, and SMT assembly, JEDEC trays are widely used for transporting packaged ICs across production environments.
Key Features
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Designed based on JEDEC standard outlines (MS series reference)
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Injection-molded structure for dimensional consistency
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Stackable design with controlled alignment and low warpage
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Compatible with automated systems and handlers
Material Options (Industry Standard)
Choose the right grade for your process
Most Used
MPPO (Modified PPO)
High heat resistance, low moisture absorption. Best suited for baking and high-temperature environments.
Up to 150°C
PEI / PES / PPE
Engineering plastics for high-temperature processes. Thermal limits are application dependent.
High-temp grade
ABS / PP / PS
Standard anti-static or conductive grades. Lower thermal limits — not recommended for baking processes.
Standard grade
👉 These materials are widely used in global tray manufacturing.
Heat resistance by material type
MPPO Trays
~150°C
HIGHEST
ENGINEERING PLASTICS (PEI / PES / PPE)
High
Suitable for high-temperature processes. Application dependent thermal limits.
APPLICATION DEPENDENT
STANDARD PLASTICS (ABS / PP / PS)
Low
Lower thermal limits — not suitable for baking processes.
NOT FOR BAKING
ESD Properties
Surface resistance range
Surface resistance typically in range:
Depending on material type
Both conductive and dissipative grades are available. Choose based on sensitivity of the IC device and your process requirements.
Performance Advantages
Why these trays perform better
High Dimensional Stability
Precise pocket geometry and tray flatness ensure smooth flow in automated equipment.
Low Moisture Absorption
Important for IC packaging — keeps devices safe from humidity-related damage.
Repeated Industrial Use
Designed for durability — withstands repeated use across industrial production cycles.
APPLICATIONS
BGA
QFN
QFP
SOP
LGA
Compatible IC Packages
Applications
BGA
QFN
QFP
SOP
LGA
DIP
BGA, QFN, QFP, SOP, LGA, DIP and similar IC packages
Ready to simplify your supply?
Reliable trays. Smarter processes. Better performance.